Search results for "DS"
06:28

Samsung Electronics NRD-K semiconductor R&D complex will import ASML High NA EUV lithography equipment

Samsung Electronics held the groundbreaking ceremony for the NRD-K semiconductor research and development complex at the Hwaseong campus in South Korea. The complex will become the core R&D base for Samsung Electronics' three major business units, and it is planned to invest approximately 200 trillion won to introduce the most advanced production tools and accelerate the development of next-generation memory chips by setting up a dedicated R&D line by mid-2025.
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03:46

Mitsubishi UFJ: If Trump wins, the yen is expected to maintain its downward trend

If Trump wins, the yen is expected to continue to fall against the dollar, potentially offsetting any increase expected from the Central Bank of Japan's interest rate hike. Trump's expansionary policies will have a greater impact on the dollar-yen Exchange Rate. With Trump in the lead, US Treasury yields rise, and the dollar-yen Exchange Rate hits a three-month high.
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12:40

Samsung Electronics is reportedly reorganizing its new HBM chip development team

On July 4th, Jinshi data, according to industry sources, Samsung Electronics' Device Solutions (DS) department responsible for the semiconductor business underwent a reorganization, establishing a new HBM research and development group. Sun Yongzhu, Vice President of Samsung Electronics and a high-performance DRAM design expert, was appointed as the head of the research and development group, leading the team to focus on the development of HBM3, HBM3E, and the next-generation HBM4 technology. In addition, Samsung Electronics also reorganized the Advanced Packaging (AVP) team and the Equipment Technology Experiment Institute to enhance overall technological competitiveness.
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00:01
On April 29, CIMC Vehicles Hong Kong Stock Exchange announced that the company received a notice from the U.S. Customs and Border Protection (CBP) on the results of the EAPA investigation on April 25, 2024, U.S. time. Based on the on-site verification of the EAPA investigation and all recorded materials, CBP determined that there was no substantial evidence that the wholly-owned subsidiary, CIE, had evaded U.S. anti-dumping and countervailing duties, i.e., that CIE did not import goods containing China-derived skeleton vehicles and/or their components into the U.S. market; In addition, CBP determined that there was no substantial evidence that DS Factory had circumvented the transshipment of China-origin skeleton vehicles and skeleton vehicle components to the United States through Thailand.
05:53
Samsung Electronics' top priority this year, following HBM, is to win orders from Nvidia in the semiconductor foundry sector. According to industry insiders, Samsung Electronics' semiconductor foundry division (DS) has internally designated "winning Nvidia's 3nm product orders" as the top priority task for this year. "All departments are making every effort and notifying employees who are fluent in English to prioritize the work related to receiving orders from 'Nemo' over existing tasks." Nemo is the internal customer code for Nvidia within Samsung Electronics. (Korean FNNews)
10:17
According to Businesskorea, according to South Korean sources, the Device Solutions (DS) division in charge of Samsung Electronics’ semiconductor business is developing its own large language model (LLM) of GPT-3.5 or higher. Customized artificial intelligence to improve productivity and work efficiency. It is reported that the service is expected to start its basic service as early as December this year, and provide professional search services including company knowledge and data in February next year.

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